[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Development of Sheet Type Molding Compounds for Panel Level Package
Ueno, Kenichi, Dohi, Kazuhiro, Suzuki, Yui, Hirose, MasakazuYear:
2019
Language:
english
DOI:
10.1109/ectc.2019.00-23
File:
PDF, 369 KB
english, 2019