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[IEEE 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS) - Seoul, Korea (South) (2019.1.27-2019.1.31)] 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS) - Flip-Chip Integration of Inductive CMOS Tactile Sensor with Si Cavity for Polymer-Filler/Metal-Ball Sensing Interface
Yeh, Sheng-Kai, Fang, WeileunYear:
2019
Language:
english
DOI:
10.1109/memsys.2019.8870706
File:
PDF, 2.66 MB
english, 2019