[IEEE 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS) - Seoul, Korea (South) (2019.1.27-2019.1.31)] 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS) - Flip-Chip Integration of Inductive CMOS Tactile Sensor with Si Cavity for Polymer-Filler/Metal-Ball Sensing Interface

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