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[IEEE 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Udine, Italy (2019.9.4-2019.9.6)] 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - TCAD-Enabled Machine Learning Defect Prediction to Accelerate Advanced Semiconductor Device Failure Analysis
Teo, Chea-Wei, Low, Kain Lu, Narang, Vinod, Thean, Aaron Voon-YewYear:
2019
DOI:
10.1109/sispad.2019.8870440
File:
PDF, 544 KB
2019