Prediction of the Number of Defects in Image Sensors by VM...

IEEE Transactions on Semiconductor Manufacturing 2019 / 11 Vol. 32; Iss. 4

Prediction of the Number of Defects in Image Sensors by VM Using Equipment QC Data

Okazaki, Toshiya, Okusa, Kosuke, Yoshida, Kyo
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Volume:
32
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/tsm.2019.2941585
Date:
November, 2019
File:
PDF, 1.87 MB
english, 2019
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