Thermal Analysis of Dissimilar Materials Diffusion Bonding...

Materials Science Forum 2019 / 8 Vol. 969

Thermal Analysis of Dissimilar Materials Diffusion Bonding Using Finite Element Method

Kumar, S. Suresh, Ravisankar, Balasubramanian, Sheriff, F. Mohammed Ajmal, Silvister Raju, M.J.
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Volume:
969
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.969.858
Date:
August, 2019
File:
PDF, 1.60 MB
english, 2019
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