Reliability Enhancement of a power semiconductor with...

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IEEE Transactions on Power Electronics 2019

Reliability Enhancement of a power semiconductor with optimized solder layer thickness

R, Elakkiya, Kavithaa, G, Samavatian, Vahid, Alhaifi, K., Kokabi, Alireza, Moayedi, Hossein
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Power Electronics
DOI:
10.1109/TPEL.2019.2951815
File:
PDF, 1.13 MB
english, 2019
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