[IEEE 2019 20th International Conference on Solid-State...

[IEEE 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - Berlin, Germany (2019.6.23-2019.6.27)] 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII) - A Novel Method for Mems Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin Slid Bonding

Hofmann, Christian, Frohlich, Alexander, Kimme, Jonas, Wiemer, Maik, Otto, Thomas

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Year:

2019

Language:

english

DOI:

10.1109/TRANSDUCERS.2019.8808256

File:

PDF, 3.00 MB

english, 2019

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