Multichip thinning technology with temporary bonding for...

  • Main
  • 2019 / 10
  • Multichip thinning technology with temporary bonding for...

Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

Lee, Sungho, Liang, Rui, Miwa, Yuki, Kino, Hisashi, Fukushima, Takafumi, Tanaka, Tetsu
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/1347-4065/ab4f3c
Date:
October, 2019
File:
PDF, 1.53 MB
english, 2019
Conversion to is in progress
Conversion to is failed