Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration
Lee, Sungho, Liang, Rui, Miwa, Yuki, Kino, Hisashi, Fukushima, Takafumi, Tanaka, TetsuLanguage:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/1347-4065/ab4f3c
Date:
October, 2019
File:
PDF, 1.53 MB
english, 2019