Experimental thermal performance of wallboard with hybrid microencapsulated phase change materials for building application
Li, Chaoen, Yu, Hang, Song, Yuan, Tang, Yin, Chen, Pengda, Hu, Huixin, Wang, Meng, Liu, ZhiyuanLanguage:
english
Journal:
Journal of Building Engineering
DOI:
10.1016/j.jobe.2019.101051
Date:
November, 2019
File:
PDF, 6.18 MB
english, 2019