Experimental study of current density in copper filling...

Experimental study of current density in copper filling process within deep through-silicon vias with high aspect ratio

Wang, Feng, Wang, Fuliang, Liu, Ximei, Liu, Jinzhi
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Volume:
29
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/1361-6439/ab3f3e
Date:
December, 2019
File:
PDF, 309 KB
2019
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