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[IEEE 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Udine, Italy (2019.9.4-2019.9.6)] 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) - Thermal Conductivity of Silicon Nanowire Using Landauer Approach for Thermoelectric Applications

Lee, Ming-Yi, Chuang, Min-Hui, Li, Yiming, Samukawa, Seiji
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Year:
2019
DOI:
10.1109/sispad.2019.8870404
File:
PDF, 662 KB
2019
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