[IEEE 2019 Joint International Symposium on Electromagnetic...

[IEEE 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Sapporo, Japan (2019.6.3-2019.6.7)] 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Modeling and Analysis of Multiple Coupled Through-Silicon Vias (TSVs) for 2.5-D/3-D ICs

Cho, Kyungjun, Kim, Youngwoo, Park, Junyong, Kim, Hyesoo, Kim, Seongguk, Kim, Subin, Park, Gapyeol, Son, Kyungjune, Kim, Joungho

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Year:

2019

Language:

english

DOI:

10.23919/EMCTokyo.2019.8893728

File:

PDF, 1.17 MB

english, 2019

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