[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - A novel TLP bonding based on sub-micron Ga particles
Lin, Shih-kang, Liao, Hseng-ming, Yeh, Che-yu, Yang, Chih-hanYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733446
File:
PDF, 1.85 MB
english, 2019