Joining of oxygen-free high-conductivity Cu to CuCrZr by...

Fusion Engineering and Design 2020 / 02 Vol. 151

Joining of oxygen-free high-conductivity Cu to CuCrZr by direct diffusion bonding without using an interlayer at Low temperature

Zhao, Can, Li, Fei, Chen, Yuanyuan, Huang, Yuan, Wang, Zumin
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
151
Language:
english
Journal:
Fusion Engineering and Design
DOI:
10.1016/j.fusengdes.2019.111400
Date:
February, 2020
File:
PDF, 7.76 MB
english, 2020
Conversion to is in progress
Conversion to is failed