Configuration for High-speed Transmission between Flip-chip...

Transactions of The Japan Institute of Electronics Packaging 2018 Vol. 11

Configuration for High-speed Transmission between Flip-chip Packages Using Low Loss and Flexible Substrate

Akahoshi, Tomoyuki, Mizutani, Daisuke, Sugimoto, Kaoru, Kouzai, Hiroaki, Watanabe, Mitsuhiro
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Volume:
11
Year:
2018
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.11.E17-016-1
File:
PDF, 1.69 MB
english, 2018
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