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Influence of Sputtering Conditions to Photoresist Profiles and Bump Shapes after Plating
MISUMI, Kouichi, YAMANOUCHI, Atsushi, SENZAKI, Takahiro, WASHIO, Yasushi, HONMA, HideoVolume:
11
Year:
2008
Journal:
Journal of Japan Institute of Electronics Packaging
DOI:
10.5104/jiep.11.72
File:
PDF, 7.60 MB
2008