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Intermetallic compounds formation and joints properties of electroplated Sn–Zn solder bumps with Cu substrates
Hou, Zhuangzhuang, Niu, Te, Zhao, Xiuchen, Liu, Ying, Yang, TianqiVolume:
30
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-019-02412-8
Date:
November, 2019
File:
PDF, 2.44 MB
2019