Correlation Between the Growth of Voids and Ni3Sn4 Intermetallic Compounds at SnAg/Ni and SnAgCuBiSbNi/Ni Interfaces at Temperatures up to 200°C
Hadian, Faramarz, Schoeller, Harry, Cotts, EricJournal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07727-0
Date:
October, 2019
File:
PDF, 7.34 MB
2019