Effect of Multiple Reflowing Processes on Interfacial...

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Journal of Electronic Materials 2019 / 10

Effect of Multiple Reflowing Processes on Interfacial Reactions and Mechanical Properties between Sn-9.0 wt.%Zn, Sn-3.0 wt.%Ag-0.5 wt.%Cu Solders and Ag Substrate

Liu, Chia-Yu, Kuo, Po-Cheng, Chen, Chih-Ming, Dai, Jia-Ying, Yen, Yee-Wen, Pasana, Alberto S.
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Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07752-z
Date:
October, 2019
File:
PDF, 3.26 MB
2019
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