Multi-layered copper foil reinforced by co-deposition of...

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Materials Letters 2019 / 11

Multi-layered copper foil reinforced by co-deposition of single-walled carbon nanotube based on electroplating technique

Shimizu, Masahiro, Ogasawara, Takayuki, Ohnuki, Tomonari, Arai, Susumu
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Language:
english
Journal:
Materials Letters
DOI:
10.1016/j.matlet.2019.126993
Date:
November, 2019
File:
PDF, 1.76 MB
english, 2019
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