Electroplated gold micro studs for thermocompression...

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IEEE Transactions on Components Packaging and Manufacturing Technology 2019

Electroplated gold micro studs for thermocompression bonding of UV LED chips

Stolmacker, C., Ploch, N. Lobo, Thies, A., Hochheim, S., Rass, J., Schnieder, F., Mogilatenko, A., Ruschel, J., Kolbe, T., Knigge, S., Einfeldt, S.
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Year:
2019
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2019.2949089
File:
PDF, 807 KB
english, 2019
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