[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low Temperature Cu-to-Cu Direct Bonding with thin gold capping on Highly -orientated Nanotwinned Cu Films
Chen, Fu-Chian, Wu, Yu-Ting, Chen, ChihYear:
2019
Language:
english
DOI:
10.23919/LTB-3D.2019.8735271
File:
PDF, 220 KB
english, 2019