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[IEEE 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - New Orleans, LA, USA (2019.7.22-2019.7.26)] 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) - Experimental Validation of an Integrated Circuit Transient Electromagnetic Event Sensor
Marathe, Shubhankar, Patnaik, Abhishek, Ghosh, Kaustav, Kim, Jingook, Pommerenke, David, Beetner, Daryl G.Year:
2019
Language:
english
DOI:
10.1109/isemc.2019.8825266
File:
PDF, 723 KB
english, 2019