Mechanical properties of Sn-58 wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests
Lee, Choong-Jae, Min, Kyung Deuk, Park, Hyun Joon, Jung, Seung-BooLanguage:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2019.153077
Date:
November, 2019
File:
PDF, 1.98 MB
english, 2019