[IEEE 2019 IEEE 69th Electronic Components and Technology...

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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Process Induced Wafer Warpage Optimization for Multi-chip Integration on Wafer Level Molded Wafer

Huang, Chen-Yu, Ng, Daniel, Lee, Hung-Ho, Lin, Vito, Lin, Chang-Fu, Chung, C. Key
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Year:
2019
DOI:
10.1109/ECTC.2019.00199
File:
PDF, 833 KB
2019
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