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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - An Assessment of Electromigration in 2.5D Packaging
Xu, Jiefeng, McCann, Scott, Wang, Huayan, Wang, Jing, Pham, VanLai, Cain, Stephen R., Refai-Ahmed, Gamal, Park, S.B.Year:
2019
DOI:
10.1109/ectc.2019.00-25
File:
PDF, 794 KB
2019