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Investigation of the use of Solderjet Bumping for joining the thinwalled glass package of a complex mechatronic lens implant
Rheinschmitt, L., Burkhardt, T., Nagel, J. A., Beckert, E., Gengenbach, U., Bretthauer, G.Volume:
57
Journal:
Biomedical Engineering / Biomedizinische Technik
DOI:
10.1515/bmt-2012-4267
Date:
January, 2012
File:
PDF, 902 KB
2012