Investigation of the use of Solderjet Bumping for joining...

Investigation of the use of Solderjet Bumping for joining the thinwalled glass package of a complex mechatronic lens implant

Rheinschmitt, L., Burkhardt, T., Nagel, J. A., Beckert, E., Gengenbach, U., Bretthauer, G.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
57
Journal:
Biomedical Engineering / Biomedizinische Technik
DOI:
10.1515/bmt-2012-4267
Date:
January, 2012
File:
PDF, 902 KB
2012
Conversion to is in progress
Conversion to is failed