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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - A Study of 3D Packaging Interconnection Performance Affected by Thermal Diffusivity and Pressure Transmission
Jung, Jin-San, Lee, Hyeong Gi, Kim, Ji-Min, Park, Yong-Jin, Yu, Ji-In, Park, Yong Sung, Lim, Jun Su, Choi, Hyun-Seok, Cho, Sung-Il, Kim, Dong wook, An, Sang-HoYear:
2019
DOI:
10.1109/ECTC.2019.00038
File:
PDF, 270 KB
2019