[IEEE 2019 Joint International Symposium on Electromagnetic...

[IEEE 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Sapporo, Japan (2019.6.3-2019.6.7)] 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Design and Analysis of Flexible Interconnects on an Extremely Thin Silicon Substate for Flexible Wearable Devices

Jeong, Seungtaek, Kim, Subin, Kim, Youngwoo, Park, Shinyoung, Park, Hyunwook, Kim, Joungho, Lee, Jae Hak, Song, Jun Yeob

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Year:

2019

Language:

english

DOI:

10.23919/EMCTokyo.2019.8893905

File:

PDF, 728 KB

english, 2019

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