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[IEEE 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Sapporo, Japan (2019.6.3-2019.6.7)] 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) - Characterization of Insertion Loss of Striplines on Various Substrate Materials as a Function of Temperature
Hsu, Jimmy, Ong, Chong-Jin, Ye, XiaoningYear:
2019
Language:
english
DOI:
10.23919/EMCTokyo.2019.8893768
File:
PDF, 469 KB
english, 2019