[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - Direct Power Board Bonding Technology for 3D Power Module Package
Ishibashi, Hidetoshi, Yoshida, Hiroshi, Murata, Daisuke, Morisaki, Shota, Rokubuichi, Hodaka, Minamide, Ayumi, Asaji, NobuhiroYear:
2019
Language:
english
DOI:
10.23919/ICEP.2019.8733451
File:
PDF, 439 KB
english, 2019