[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Effect of N 2 plasma treatment in Cu/SiO 2 hybrid bonding using ultra-thin manganese film
Tsumura, Kazumichi, Uchida, Kengo, Nakamura, Kenro, Nagata, Takahiro, Higashi, Kazuyuki, Kojima, Akihiro, Shibata, HidekiYear:
2019
Language:
english
DOI:
10.23919/LTB-3D.2019.8735349
File:
PDF, 440 KB
english, 2019