LSI-package Co-design Methodology for Thin Embedded-LSI Package Used as Bottom Package of Package-on-Package Structures
Ohshima, Daisuke, Nakashima, Yoshiki, Kikuchi, Katsumi, Takemura, Koichi, Masu, KazuyaVolume:
7
Year:
2014
Language:
english
Journal:
Transactions of The Japan Institute of Electronics Packaging
DOI:
10.5104/jiepeng.7.104
File:
PDF, 3.90 MB
english, 2014