Effect of Sn surface diffusion on growth behaviors of intermetallic compounds in cu/Ni/SnAg microbumps
Yang, Chenlin, Ren, Siru, Zhang, Xundi, Hu, Anmin, Li, Ming, Gao, Liming, Ling, Huiqin, Hang, TaoJournal:
Materials Characterization
DOI:
10.1016/j.matchar.2019.110030
Date:
November, 2019
File:
PDF, 1.54 MB
2019