[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Pre-Cure Modification of Electrically Conductive Adhesive for Low Temperature Interconnection
George, Jinto, Danovitch, David, Leblanc, Alexandre, Savage, Eric, Ayukawa, Michael, Macaisa, DexterYear:
2019
DOI:
10.1109/ectc.2019.00-30
File:
PDF, 940 KB
2019