![](/img/cover-not-exists.png)
[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Thermal and Mechanical Simulations for Fan-Out Wafer-Level Packaging Technology: Introduction of a "Solder Heatsink"
Colonna, Jean-Philippe, Marnat, Loic, Cartier, Mathilde, Pares, Gabriel, Noguet, DominiqueYear:
2019
DOI:
10.1109/ectc.2019.00236
File:
PDF, 1.47 MB
2019