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[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Development of 2.3D High Density Organic Package using Low Temperature Bonding Process with Sn-Bi Solder
Miki, Shota, Taneda, Hiroshi, Kobayashi, Naoki, Oi, Kiyoshi, Nagai, Koji, Koyama, ToshinoriYear:
2019
DOI:
10.1109/ECTC.2019.00246
File:
PDF, 1.11 MB
2019