[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - A Novel Metal Scheme and Bump Array Design Configuration to Enhance Advanced Si Packages CPI Reliability Performance by Using Finite Element Modeling Technique
Chang, Kuo-Chin, Lii, Mirng-Ji, Hsu, Steven, Liu, Hao-Chun, Lai, Yen-Kun, Tsai, Sheng-Han, Hsu, Chieh-HaoYear:
2019
DOI:
10.1109/ectc.2019.00067
File:
PDF, 846 KB
2019