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Surface Density Gradient Engineering Precedes Enhanced Diffusion; Drives CMOS In-Line Process Flow Compatible Cu–Cu Thermocompression Bonding at 75 °C
Panigrahy, Asisa Kumar, Ghosh, Tamal, Vanjari, Siva Rama Krishna, Singh, Shiv GovindVolume:
19
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2019.2952927
Date:
December, 2019
File:
PDF, 588 KB
2019