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[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Process Development for Flip Chip Bonding with Different Bump Compositions
Massa, Samuel, Shahin, David, Wathuthanthri, Ishan, Drechsler, Annaliese, Basantkumar, RajneetaYear:
2019
DOI:
10.23919/IWLPC.2019.8913986
File:
PDF, 502 KB
2019