[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Highly Integrated SIP for Mobile Device
Kim, JungHwa, Lee, Heeseok, Choi, HeeJung, Jeong, James, Im, YunhyeokYear:
2019
DOI:
10.23919/IWLPC.2019.8914111
File:
PDF, 465 KB
2019