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[IEEE 2019 International Conference on Electronics Packaging (ICEP) - Niigata, Japan (2019.4.17-2019.4.20)] 2019 International Conference on Electronics Packaging (ICEP) - GaAs Diode Rectifier Power Module in mixed Ag- and Large Area Cu-Sintering Technology for Ultra-Fast and Wireless Electric Vehicle Battery Charging
Blank, Thomas, Dudek, Volker, Luh, Matthias, An, Bao Ngoc, Wurst, Helge, Leyrer, Benjamin, Ishikawa, Dai, Weber, MarcYear:
2019
DOI:
10.23919/ICEP.2019.8733484
File:
PDF, 1.75 MB
2019