Internal Stress Induced during Curing Process of Adhesively...

Internal Stress Induced during Curing Process of Adhesively Bonded Parts of Resin and Metal.

NAKAMURA, Hirohumi, SATO, Chiaki, IKEGAMI, Kozo
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Volume:
46
Year:
1997
Journal:
Journal of the Society of Materials Science, Japan
DOI:
10.2472/jsms.46.820
File:
PDF, 1.04 MB
1997
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