Reliability Enhancement of Copper/Porous SiOCH Metallization Systems Using Nitrogen Stuffing and Bias-Filter Sputter Deposited Mn 2 O 3 Barrier
Fang, Jau-Shiung, Yu, Kuang-Yu, Chen, Sung-Te, Cheng, Yi-Lung, Wang, Yi-Sheng, Chen, Giin-ShanVolume:
8
Year:
2019
Journal:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.0011912jss
File:
PDF, 752 KB
2019