Effect of Zinc Addition on the Evolution of Interfacial...

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Journal of Electronic Materials 2019 / 12

Effect of Zinc Addition on the Evolution of Interfacial Intermetallic Phases at Near-Eutectic 50In-50Sn/Cu Interfaces

Wang, Jingze, Mao, Dongxin, Chen, Hongtao, Zhang, Xiaohua, Shi, Lei, Wang, Jianbing
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Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07838-8
Date:
December, 2019
File:
PDF, 1.08 MB
2019
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