Microstructures and Mechanical Properties of Sn-58 wt.% Bi Solder with Ag-Decorated Multiwalled Carbon Nanotubes Under 85°C/85% Relative Humidity Environmental Conditions
Min, Kyung Deuk, Lee, Choong-Jae, Park, Hyun-Joon, Jung, Seung-BooJournal:
Journal of Electronic Materials
DOI:
10.1007/s11664-019-07863-7
Date:
December, 2019
File:
PDF, 5.82 MB
2019