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[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Analytical Modeling of Through-PCB Thermal Vias and Heat-Sinks for Integrated Power Electronics
Catalano, Antonio Pio, Trani, Roberto, Castellazzi, Alberto, d'Alessandro, VincenzoYear:
2019
DOI:
10.1109/THERMINIC.2019.8923386
File:
PDF, 916 KB
2019