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[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions
Langbauer, Thomas, Mentin, Christian, Rindler, Michael, Vollmaier, Franz, Connaughton, Alexander, Krischan, KlausYear:
2019
DOI:
10.1109/THERMINIC.2019.8923595
File:
PDF, 1.33 MB
2019