[IEEE 2019 25th International Workshop on Thermal...

  • Main
  • [IEEE 2019 25th International Workshop...

[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions

Langbauer, Thomas, Mentin, Christian, Rindler, Michael, Vollmaier, Franz, Connaughton, Alexander, Krischan, Klaus
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2019
DOI:
10.1109/THERMINIC.2019.8923595
File:
PDF, 1.33 MB
2019
Conversion to is in progress
Conversion to is failed