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[IEEE 2019 International Wafer Level Packaging Conference (IWLPC) - San Jose, CA, USA (2019.10.22-2019.10.24)] 2019 International Wafer Level Packaging Conference (IWLPC) - Chip to Wafer Hybrid Bonding with Cu Interconnect: High Volume Manufacturing Process Compatibility Study
Gao, Guilian, Mrozek, Pawel, Workman, Thomas, Mirkarimi, Laura, Fountain, Gill, Theil, Jeremy, Guevara, Gabe, Uzoh, Cyprian, Lee, Bongsub, Liu, PingYear:
2019
DOI:
10.23919/iwlpc.2019.8913877
File:
PDF, 584 KB
2019