[IEEE 2019 International Electronics Symposium (IES) - Surabaya, Indonesia (2019.9.27-2019.9.28)] 2019 International Electronics Symposium (IES) - Shape Recognition of Material Heaps in Outdoor Environments and Optimal Excavation Planning
Finkbeiner, Martin Satoshi, Uchiyama, Naoki, Sawodny, OliverYear:
2019
DOI:
10.1109/ELECSYM.2019.8901670
File:
PDF, 4.01 MB
2019